Function: Suitable for high-quality single-sided, double-sided and multi-layer circuit boards to remove film after etching. The equipment adopts a unique vertical transmission method, scientific nozzle arrangement and fan-shaped nozzle spraying method to effectively solve the etching uniformity; two-stage structure: It has both etching function and water washing function, and the wastewater can be recycled after treatment.
Technical parameters:
* Minimum material removal resolution: 0.075mm (3mil)
* Maximum processing area: 300mm×400mm
* Production capacity: 12 pieces/h
* Maximum moving speed: 28mm/s
* Transmission mode: vertical circulation chain, adjustable transmission speed
* Spray transmission structure protected by independent intellectual property rights
* Heating power: 1000 W, with temperature control function
* Number of nozzles: 4 groups in front and back
* Nozzle arrangement: 5/6 nozzles staggered arrangement
* Spray pressure: 2kg/cm in front and back
* With automatic alarm function after processing
* Temperature range: 20-60℃
* Power supply: 220VAC/50Hz
* Power: 2kW
* Weight: 140kg
* Dimensions (length/width/height): 1440mm×650mm×1280mm
