Function: Used in the carbon film hole metallization process in the PCB manufacturing process, through the simplest and most reliable steps such as degreasing, water washing, black hole, drying, electroplating copper, etc. to achieve reliable interlayer conduction of PCB.
Technical parameters:
* The equipment has two built-in electroplating tanks
* Two sets of circuit boards can be electroplated at the same time
* Maximum circuit board size: 300mm x 400mm
* Minimum hole diameter: 0.2mm (8mil)
* Carbon black colloid is used as the activation solution
* Equipped with swing function
* Equipped with air stirring function
* Equipped with circulation filtration function
* The equipment has anode shielding, and the ratio of cathode and anode area is 2:1
* With OSP treatment tank, it can apply organic anti-oxidation solder film to bare copper PCB
* Power supply: 220VAC/50Hz
* Power: 2.2kW
* Weight: 280KG
* Dimensions (length/width/height): 2138mm×826mm×1170mm
