Function: Used for pressing multilayer circuit boards of different types and materials. Built-in microcontroller controls the whole process of hot pressing of multilayer circuit boards; the process adopts efficient heating and heat dissipation design, and the heating and cooling time are short; the entire pressing plate can be evenly pressed to ensure that the internal structure of the multilayer PCB after pressing is uniform and consistent, and long-term stability without delamination.
Performance parameters:
* Maximum wiring size: 285mm×205mm
* Maximum lamination area: 305mm×230mm
* Can press two multilayer boards at the same time
* Maximum temperature: 300℃
* Number of circuit board layers: 8 layers (related to materials and design)
* Lamination time: about 90 minutes
* Maximum lamination pressure: 300N/cm² (20 tons)
* Temperature, pressure, and time parameters can be adjusted through the navigation key
* Process parameters are displayed on the LCD screen
* Built-in multiple lamination programs
* Power supply: 220VAC/50Hz
* Power: 2.1kW
* Weight: 180kg
* Dimensions (length/width/height): 550mm×550mm×700mm
